The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6924211 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 02, 2005

Filed:

Feb. 12, 2003
Applicants:

Osamu Yamazaki, Saitama, JP;

Kazuyoshi Gbe, Shiraoka-machi, JP;

Inventors:

Osamu Yamazaki, Saitama, JP;

Kazuyoshi Gbe, Shiraoka-machi, JP;

Assignee:

Lintec Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/301 ;
U.S. Cl.
CPC ...
Abstract

A semiconductor chip carrying adhesive tape, wherein a plurality of adhesive agent portions for adhering semiconductor chipsare intermittently formed on a tape shaped base materialin the longitudinal direction of the base materialto have a substantially identical shape with that of the semiconductor chipto be adhered or a slightly larger shape than that, and an adhesive agent constituting said adhesive agent portionshas gradable adhesiveness, can improve a yield of adhesive agent attached semiconductor chipsand prevent a wasteful use of an adhesive agent.


Find Patent Forward Citations

Yamazaki, Osamu. (2005). Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body (U.S. Patent No. 6924211). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6924211

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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