The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
Dec. 27, 2002
Jin Woo Cheon, Daejun-Shi, KR;
Sung Nam Cho, Chungcheongnam-Do, KR;
Jong IL Park, Gyeongsangbuk-Do, KR;
Kyung Bok Lee, Ulsan-Shi, KR;
Seok Chang, Daejun-Shi, KR;
Soon Taik Hwang, Sungnam-Shi, KR;
Jin Woo Cheon, Daejun-Shi, KR;
Sung Nam Cho, Chungcheongnam-Do, KR;
Jong Il Park, Gyeongsangbuk-Do, KR;
Kyung Bok Lee, Ulsan-Shi, KR;
Seok Chang, Daejun-Shi, KR;
Soon Taik Hwang, Sungnam-Shi, KR;
Samsung Electronics Co., Ltd., Kyungki-Do, KR;
Korea Advanced Institute of Science and Technology, Daejun-Shi, KR;
Abstract
Disclosed are a metallic nanoparticle cluster ink and a method for forming a conductive metal pattern using the cluster ink. The metallic nanoparticle cluster ink comprises colloidal metallic nanoparticles and a bifunctional compound. The conductive metal pattern is formed by forming a metallic nanoparticle pattern on a substrate using a mold made from PDMS (poly(dimethylsiloxane) polymer as a stamp, and heat-treating the substrate. Micrometer-sized conductive metal patterns can be easily formed on various substrates in a simple and inexpensive manner without the use of costly systems, thereby being very useful in various industrial fields.