The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2005
Filed:
Jan. 24, 2002
Applicant:
Takayuki Matsushima, Kanuma, JP;
Inventor:
Takayuki Matsushima, Kanuma, JP;
Assignee:
Sony Chemicals Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L063/00 ;
U.S. Cl.
CPC ...
Abstract
A novel adhesive cures quickly at a lower temperature and ensures reliable connection of objects the adhesive connects with each other. The adhesive includes a metal chelate, a silane coupling agent and a thermosetting resin. The silane coupling agent in the adhesive is hydrolyzed at its alkoxy groups to form silanol groups, which in turn react with the metal chelate to produce cations in the adhesive. The resulting cations cause the epoxy resin as a thermosetting resin, to undergo cationic polymerization. The adhesive of the present invention cures at a lower temperature by taking advantage of the cationic polymerization.