The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2005
Filed:
Nov. 10, 2003
Randy Neaman Siade, Chandler, AZ (US);
Terry Sinclair Connacher, Scottsdale, AZ (US);
James Vernon Rhodes, Chandler, AZ (US);
James Mason Brafford, Mission Viejo, CA (US);
John Charles Montgomery, Poway, CA (US);
David Jon Mortensen, Mission Viejo, CA (US);
Randy Neaman Siade, Chandler, AZ (US);
Terry Sinclair Connacher, Scottsdale, AZ (US);
James Vernon Rhodes, Chandler, AZ (US);
James Mason Brafford, Mission Viejo, CA (US);
John Charles Montgomery, Poway, CA (US);
David Jon Mortensen, Mission Viejo, CA (US);
Unisys Corporation, Blue Bell, PA (US);
Abstract
An electromechanical system for testing IC-chips includes a chip holding subassembly which has sockets for holding a group of IC-modules that include the IC-chips; a moving mechanism for automatically moving the chip holding subassembly from a load position in the system to a test position in the system, and visa-versa; a temperature control mechanism which contacts the IC-modules on the chip holding subassembly only when that subassembly is at the test position; and a chip handler mechanism for automatically moving the IC-modules into and out of the sockets, when the chip holding subassembly is at the load position. At the test position, the temperature control mechanism contacts the IC-modules to control their temperature. At the load position, the chip handler mechanism automatically unloads one group of IC-modules from the sockets on the chip holding subassembly and automatically loads another group of the IC-modules into the sockets.