The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2005
Filed:
Aug. 01, 2003
Applicants:
Takeo Kuramoto, Atsugi, JP;
Kaichi Tsuruta, Tochigi, JP;
Inventors:
Takeo Kuramoto, Atsugi, JP;
Kaichi Tsuruta, Tochigi, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ; H01L023/52 ; H01L029/40 ;
U.S. Cl.
CPC ...
Abstract
A solder ball assembly includes a mask having first and second sides and a plurality of holes formed therein. Each hole has a first end opening onto the first side of the mask and a second end. A plurality of solder balls are disposed in the holes, and a fixing agent secures the solder balls in the holes. A protective sheet may be attached to one or both sides of the mask to cover the ends of the holes.
Kuramoto, Takeo. (2005). Solder ball assembly, a method for its manufacture, and a method of forming solder bumps (U.S. Patent No. 6919634). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6919634
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile