The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2005
Filed:
Jan. 21, 2003
Masayuki Shinkai, Ama-Gun, JP;
Takahiro Ishikawa, Toyoake, JP;
Masahiro Kida, Ama-gun, JP;
Mitsuru Ohta, Inazawa, JP;
Masayuki Shinkai, Ama-Gun, JP;
Takahiro Ishikawa, Toyoake, JP;
Masahiro Kida, Ama-gun, JP;
Mitsuru Ohta, Inazawa, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
A bonded member including a ceramic base materialand a metallic memberwhich are bonded together, wherein a solder materialcomprising Au is disposed on the surface of the ceramic base materialvia an active metal layer, the active metal layer and the solder materialare molten by heating so as to form a precoat layer, the metallic memberis disposed on the surface of the precoat layervia an insertion metal layer comprising pure metal which may form an alloy having a lower melting point than Au with Au or an alloy of the pure metal and Au, and the insertion metal layer and at least a portion in the vicinity of the interface between the insertion metal layer and the precoat layerare molten by heating to bond the metallic memberand the precoat layer