The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2005
Filed:
Sep. 25, 2002
Nobuyoshi Tsukaguchi, Nagano, JP;
Masami Kimura, Chiba, JP;
Nobuyoshi Tsukaguchi, Nagano, JP;
Masami Kimura, Chiba, JP;
Dowa Mining Co., Ltd., Tokyo, JP;
Abstract
After copper platesare bonded to both sides of a ceramic substratevia a brazing filler metal, UV curing alkali peeling type resistsare applied on predetermined portions of the surfaces of the copper platesto etch undesired portions of the copper platesto form a metal circuit portion. While the resistsare maintained, undesired portions of the brazing filler metaland a reaction product, which is produced by a reaction of the brazing filler metalwith the ceramic substrate, are removed (or undesired portions of the brazing filler metaland a reaction product, which is produced by a reaction of the brazing filler metalwith the ceramic substrate, are removed, and the side portion of the metal circuit portion is etched). Thereafter, the resistsare peeled off, and an Ni—P electroless platingis carried out. Thus, in a method for producing a metal/ceramic bonding circuit board, it is possible to easily control the sectional shape of a metal/ceramic bonding circuit board by a smaller number of steps and at low costs, and it is possible to produce a metal/ceramic bonding circuit board which is more reliable with respect to thermal shock resistance and insulation performance.