High power interface

Abstract

In one embodiment a high power interface apparatus is provided having a multilayer laminated cable including force conductor planes having flush and recessed portions and return conductor planes having flush and recessed portions. The flush portions of the conductor planes extend to a contact end of the laminated cable and the recessed portions are removed from the contact end. The flush portions are aligned along axes at the contact end. The flush portions of the return conductor planes are aligned at the contact end along axes aligned within recessed portions of the force conductor planes. A dielectric material separates the force and return conductor planes. Surface contact pads may be provided on the contact end including force contact pads, each contacting and extending along aligned flush portions of the force conductor planes, and including return conductor pads, each contacting and extending along aligned flush portions of the return conductor planes. The contact pads may be formed by plating the end, and then scoring. The multilayer laminate cable can be formed with a rigid portion near the contact end and a flexible portion between the cable ends. In some embodiments the force and return conductor planes of the flexible portion extend to the ends of the cable while the rigid portion can be formed with additional force and return conductor planes. Through vias may be included at the rigid portion to electrically couple the force conductor planes together and to electrically coupling the return conductor planes together.