The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
Sep. 30, 2002
Applicants:
Takao Fujikawa, Takasago, JP;
Tetsuya Yoshikawa, Takasago, JP;
Inventors:
Takao Fujikawa, Takasago, JP;
Tetsuya Yoshikawa, Takasago, JP;
Assignee:
Kabushiki Kaisha Kobe Seiko Sho, Kobe, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L021/4763 ; H01L021/76 ;
U.S. Cl.
CPC ...
Abstract
A temporary support layeris formed on a semiconductor substrateand the temporary support layeris provided with a holethat reaches the semiconductor substrateThe holeis filled in with a conductor materialand by pressurizing the conductor materialthe conductor materialand the semiconductor substrateare pressure-bonded. Thereby, an aerial wiring structure whose bonding strength is improved and that has excellent self-sustainability can be obtained.