The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
Jan. 15, 2003
Takashi Wada, Kodaira, JP;
Kazunari Suzuki, Tokyo, JP;
Chuichi Miyazaki, Akishima, JP;
Toshihiro Shiotsuki, Higashimurayama, JP;
Tomoko Higashino, Tokyo, JP;
Takashi Wada, Kodaira, JP;
Kazunari Suzuki, Tokyo, JP;
Chuichi Miyazaki, Akishima, JP;
Toshihiro Shiotsuki, Higashimurayama, JP;
Tomoko Higashino, Tokyo, JP;
Renesas Technology Corporation, Tokyo, JP;
Hitachi ULSI Systems Co., Ltd., Tokyo, JP;
Abstract
A contact collect is provided to prevent damage to the top surface of a semiconductor chip at the time of die bonding the semiconductor chip. A protection tape is pasted to the top surface of the semiconductor chip before die bonding of the semiconductor chip is executed by pressing the back surface (underside) of the semiconductor chip sucked and securely held by the contact collect against respective chip-mounting regions of a multi-wiring board. The contact collect is, for example, substantially cylidrical in outside shape, and a bottom part (suction head) thereof is made of soft synthetic rubber, etc. The protection tape pasted to the top surface of the semiconductor chip prevents the top surface of the semiconductor chip from directly contacting with the contact collect even at the time of vacuum suction by pressing the suction head of the contact collect against the top surface of the semiconductor chip.