The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
Sep. 05, 2002
Applicants:
Naoyuki Jimbo, Gifu-ken, JP;
Yuji Okuda, Gifu-ken, JP;
Shigeharu Ishikawa, Gifu-ken, JP;
Atsushi Mishima, Gifu-ken, JP;
Inventors:
Naoyuki Jimbo, Gifu-ken, JP;
Yuji Okuda, Gifu-ken, JP;
Shigeharu Ishikawa, Gifu-ken, JP;
Atsushi Mishima, Gifu-ken, JP;
Assignee:
Ibiden Co., Ltd., Gifu-Ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B001/00 ;
U.S. Cl.
CPC ...
Abstract
A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.