The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2005
Filed:
Oct. 10, 2003
Thomas H. Dozier, Ii, Livermore, CA (US);
Benjamin N. Eldridge, Danville, CA (US);
Gary W. Grube, Pleasanton, CA (US);
Igor Y. Khandros, Orinda, CA (US);
Gaetan L. Mathieu, Livermore, CA (US);
Thomas H. Dozier, II, Livermore, CA (US);
Benjamin N. Eldridge, Danville, CA (US);
Gary W. Grube, Pleasanton, CA (US);
Igor Y. Khandros, Orinda, CA (US);
Gaetan L. Mathieu, Livermore, CA (US);
FormFactor, Inc., Livermore, CA (US);
Abstract
Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a support substrate, and solder-ball (or other suitable) contact structures disposed on a bottom surface of the support substrate. Composite interconnection elements are described for use as the resilient contact structures disposed atop the support substrate. In use, the support substrate is soldered down onto the circuit board, the contact structures on the bottom surface of the support substrate contacting corresponding contact areas on the circuit board. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate.