Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same

Abstract

Dielectric collars are configured to be positioned laterally around contact pads of a semiconductor device or another substrate. Substrates on which the collars are positioned and that include contact pads that are exposed through the collars are also disclosed, as are methods for fabricating the collars and for positioning the collars on substrates. The collars may be positioned laterally adjacent to the contact pads of a substrate before or after conductive structures are secured to the contact pads. When the conductive structures are electrically connected to contact pads of another semiconductor device component, the collars prevent the material of the conductive structures from contacting regions of the surface of the substrate or other semiconductor device component that surround the contact pads. The collars may be pre-formed structures that are assembled with the substrate, or they may be formed on the substrate. A stereolithographic method of fabricating the collars is disclosed.