The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2005
Filed:
Mar. 20, 2003
Hiroshi Kikuchi, Hidaka, JP;
Norio Nakazato, Kashiwa, JP;
Hideko Ando, Ome, JP;
Takashi Suga, Yokohama, JP;
Satoru Isomura, Hamura, JP;
Takashi Kubo, Chiyoda, JP;
Hiroyasu Sasaki, Yokohama, JP;
Masanori Fukuhara, Tachikawa, JP;
Naotaka Tanaka, Chiyoda, JP;
Fujiaki Nose, Ome, JP;
Hiroshi Kikuchi, Hidaka, JP;
Norio Nakazato, Kashiwa, JP;
Hideko Ando, Ome, JP;
Takashi Suga, Yokohama, JP;
Satoru Isomura, Hamura, JP;
Takashi Kubo, Chiyoda, JP;
Hiroyasu Sasaki, Yokohama, JP;
Masanori Fukuhara, Tachikawa, JP;
Naotaka Tanaka, Chiyoda, JP;
Fujiaki Nose, Ome, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.