The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2005
Filed:
Dec. 19, 2001
Shuhei Ishikawa, Handa, JP;
Takahiro Ishikawa, Nagoya, JP;
Masahiro Kida, Ama-Gun, JP;
Ken Suzuki, Handa, JP;
Shuhei Ishikawa, Handa, JP;
Takahiro Ishikawa, Nagoya, JP;
Masahiro Kida, Ama-Gun, JP;
Ken Suzuki, Handa, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
A member for use in an electronic circuit has a thermally conductive layer mounted on a heat sink. The thermally conductive layer comprises an insulating substrate, a first joint member joining the insulating substrate to the heat sink and containing an active element, a second joint member disposed on the insulating substrate, and an electrode disposed on the second joint member. The insulating substrate comprises an AlN layer or an SiNlayer. Each of the first and second joint members is made of a hard brazing material containing an active element. The heat sink is made of an SiC/Cu composite material or a C/Cu composite material.