The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6910943 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 28, 2005

Filed:

Jun. 19, 2002
Applicants:

Toshihiko Ishikawa, Mitaka, JP;

Yasushi Katagiri, Mitaka, JP;

Inventors:

Toshihiko Ishikawa, Mitaka, JP;

Yasushi Katagiri, Mitaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B049/00 ; B24B051/00 ;
U.S. Cl.
CPC ...
Abstract

A polishing stage is mounted on a body provided with a rough grinding stage and a fine grinding stage so that a wafer can be roughly ground, finely ground and polished in one planarization apparatus. The planarization apparatus also has a cleaning stage for cleaning a polishing pad of the polishing stage to thereby clean the dirty cleaning pad. The planarization apparatus is also provided with an etching unit to thereby perform a sequence of planarization from the rough grinding to the etching.


Find Patent Forward Citations

Ishikawa, Toshihiko. (2005). Planarization apparatus and method (U.S. Patent No. 6910943). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6910943

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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