The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2005
Filed:
Jun. 19, 2002
Applicants:
Toshihiko Ishikawa, Mitaka, JP;
Yasushi Katagiri, Mitaka, JP;
Inventors:
Toshihiko Ishikawa, Mitaka, JP;
Yasushi Katagiri, Mitaka, JP;
Assignee:
Tokyo Seimitsu Co., Ltd., Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B049/00 ; B24B051/00 ;
U.S. Cl.
CPC ...
Abstract
A polishing stage is mounted on a body provided with a rough grinding stage and a fine grinding stage so that a wafer can be roughly ground, finely ground and polished in one planarization apparatus. The planarization apparatus also has a cleaning stage for cleaning a polishing pad of the polishing stage to thereby clean the dirty cleaning pad. The planarization apparatus is also provided with an etching unit to thereby perform a sequence of planarization from the rough grinding to the etching.