The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2005
Filed:
Sep. 16, 2003
Hong Hocheng, Hsinchu City 300, TW;
Chin Chung Nien, Jhudong Township, Hsinchu County 310, TW;
Hong Hocheng, Hsinchu City 300, TW;
Chin Chung Nien, Jhudong Township, Hsinchu County 310, TW;
Other;
Abstract
The present invention provides a method for in-situ real-time monitoring of mold deformation by using a database to store temporary information during the following steps: (a) providing a mark on the mold body that is easy to observe in order to monitor the mold deformation, (b) installing a signal source and a monitor device for monitoring the deformation quantity on the mold, (c) transforming the above deformation quantity into computer signals for storing in the database and (d) issuing controlling or warning signals to the imprinting machine based on the processing results of the stored information in the database.