The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2005

Filed:

Sep. 11, 2002
Applicants:

Tetsuya Oshino, Sagamihara, JP;

Katsuhiko Murakami, Kanagawa, JP;

Hiroyuki Kondo, Kawasaki, JP;

Katsumi Sugisaki, Yokohama, JP;

Masaki Yamamoto, Sendai, JP;

Inventors:

Tetsuya Oshino, Sagamihara, JP;

Katsuhiko Murakami, Kanagawa, JP;

Hiroyuki Kondo, Kawasaki, JP;

Katsumi Sugisaki, Yokohama, JP;

Masaki Yamamoto, Sendai, JP;

Assignee:

Nikon Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G21K001/06 ;
U.S. Cl.
CPC ...
Abstract

Apparatus and methods are disclosed for milling selected regions on the surface of a multilayer-film reflective surface of an X-ray mirror to correct the reflected wavefront produced by the mirror, thereby producing a more uniform or otherwise more desirable phase distribution of the reflected wavefront. The milled multilayer films include multiple lamina sets each including respective layers of at least two respective substances. The layers usually are 'stacked' alternatingly at a fixed period length on a mirror substrate. By selectively removing one or more surficial layers in selected locations, local corrections of the phase shift of the reflective wavefront are achieved. At each milling location, the depth profile can be stepwise or smoothly gradated. Milling methods can include lapping, ion-beam bombardment, plasma-enhanced chemical vapor machining (CVM), reactive-ion etching, photochemical reactions, or laser ablation.


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