The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2005

Filed:

May. 08, 2003
Applicants:

Scott N. Seabridge, Penfield, NY (US);

Alan D. Raisanen, Sodus, NY (US);

Scott C. Warner, Ontario, NY (US);

Thomas A. Tellier, Wolcott, NY (US);

Cathie J. Burke, Rochester, NY (US);

William G. Hawkins, Webster, NY (US);

Inventors:

Scott N. Seabridge, Penfield, NY (US);

Alan D. Raisanen, Sodus, NY (US);

Scott C. Warner, Ontario, NY (US);

Thomas A. Tellier, Wolcott, NY (US);

Cathie J. Burke, Rochester, NY (US);

William G. Hawkins, Webster, NY (US);

Assignee:

Xerox Corporation, Stamford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J002/05 ;
U.S. Cl.
CPC ...
Abstract

A fluid ejector includes a fluid channel having a resistive heater and terminating in a nozzle, a common bus formed transverse to the fluid channel and between the resistive heater and the nozzle, a connection line laterally adjacent to the fluid channel, and a connection structure for electrically connecting the common bus with the resistive heater and the connection line, the connection structure including a first set of one or more layers for electrical connection and a second set of one or more layers for covering the common bus and connection line. The first set of one or more layers includes a doped polysilicon layer on or overlaid by an optional tantalum-silicide layer. The second set of one or more layers includes a nitride layer on or overlaid by a tantalum layer.


Find Patent Forward Citations

Loading…