The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2005
Filed:
Jun. 29, 2001
Ajit V. Sathe, Chandler, AZ (US);
Ajit V. Sathe, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
In substrate packaging and mounting, such as for a flip chip mounted on a thin-core or coreless substrate, a high degree of rigidness and support is imparted to the substrate, to overcome bending/flexing/distortion during mounting/packaging of the chip and to prevent possible chip damage, by a stiffener. Such a stiffener may be of one or multiple pieces in any suitable shape/form to allow its non-interfering positioning on the substrate, and made by any suitable process of any suitable material, including conductive material and material capable of withstanding the temperatures of chip mounting/bonding operations. Such a stiffener prevents bending/flexing/distortion of thin-core and coreless substrate arrangements during mounting/interconnection processes to achieve thinner and more light-weight electronics specifically afforded by thin-core/coreless substrate arrangements while lowering manufacturing time/costs.