Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assembly

Abstract

A bonding apparatus and method thereof to bond the bonding portions of an FPC cable to pads of a print head die in order to electrically connect the print head die of an ink jet print head assembly include a stage and a bonding tool. The print head die includes resistive heaters, signal lines connected to the resistive heaters, and electrical pads to connect the signal lines to an outside of the print head die to the FPC cable having conductors having bonding portions facing the pads. The print head die is supported on the stage with the pads facing upward. The bonding tool includes a tip that press bonding portions of the FPC cable against corresponding pads of the print head die placed on the stage, and heats the bonding portions in contact with the pads to bond the bonding portion to the pads. The bonding tool includes a protrusion positioned to align with a position beyond the boundary of the print head die, and that extends lower than the tip, such that, during the bonding operation, the protrusion bends the FPC cable downward. In addition, during the bonding operation, the upper protective film of the FPC cable around the bonding portions are left intact to provide protective layer over the resulting bond, and thus results in less amount of encapsulation over the bond.