The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
Dec. 17, 2002
Hideki Kurita, Kitaibaraki, JP;
Masashi Nakamura, Toda, JP;
Hideki Kurita, Kitaibaraki, JP;
Masashi Nakamura, Toda, JP;
Nikko Materials Co., Ltd., Tokyo, JP;
Abstract
In a semiconductor wafer (W) having a periphery thereof chamfered, and having at least a main surface side thereof subjected to mirror finishing, an inclined surface () is formed on the periphery of the wafer, such that has an angle (θ) of inclination of the inclined surface () with respect to a main surface () is not smaller than 5° and not larger than 25°, and at the same time a length (L) of the same in the radial direction of the wafer is 100 μm or longer. Further, the inclined surface is configured to have a non-mirror-finished portion () toward the periphery of the wafer.