The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2005
Filed:
May. 27, 2002
Naoto Tate, Annaka, JP;
Hiroji Aga, Annaka, JP;
Naoto Tate, Annaka, JP;
Hiroji Aga, Annaka, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Abstract
A bonded waferand a residual waferare placed in a state of being superimposed on each other on a susceptordisposed in a heat treatment. A Bernoulli chuckis moved to a wafer holding positionon a susceptorby driving an arm, sucks the bonded waferpositioned on the upper side and then moves to a bonded wafer recovery table' to recover the bonded wafer there. Then, similarly, the Bernoulli chucksuction holds the residual waferat the wafer holding positionand then moves to a residual wafer recovery table″ to recover the residual wafer there. With such a construction adopted, in a method for manufacturing a bonded wafer according to a so-called smart-cut method, not only is the separated bonded wafer recovered suppressing occurrence of a defect, deficiency and contamination, but there is also provided a method for manufacturing a bonded wafer capable of automation suitable for mass production.