The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6897092 B1

PDF
Full Text
Expired
Date of Patent:
May. 24, 2005

Filed:

Jun. 12, 2003
Applicant:

Brenton L. Dickey, Meridian, ID (US);

Inventor:

Brenton L. Dickey, Meridian, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/44 ; H01L023/495 ;
U.S. Cl.
CPC ...
Abstract

The invention relates to a carrier for supporting a substrate film during the chip-substrate assembly and bonding process. The carrier provides enhanced rigidity to the substrate film. The degree of rigidity and/or flexibility provided can be controlled by selection of the carrier dimensions, configuration and material choice. Advantages of embodiments of the carrier include easier handling, reduced probability of defective end products, and increased control in choosing the thinness of the substrate film. For example, the substrate film carrier can be used for lead-over-chip (LOC) assemblies and lead-under-chip (LUC) assemblies to create ball grid arrays (BGA), pin grid arrays (PGA), dual in-line packages (DIP), and the like.


Find Patent Forward Citations

Dickey, Brenton. (2005). Method of supporting a substrate film (U.S. Patent No. 6897092). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6897092

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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