The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2005
Filed:
Aug. 27, 2003
Gisela Schammler, Dresden, DE;
Mathias Böttcher, Dresden, DE;
Frank Kuechenmeister, Dresden, DE;
Daniel Gehre, Dresden, DE;
Ehrenfried Zschech, Moritzburg, DE;
Gisela Schammler, Dresden, DE;
Mathias Böttcher, Dresden, DE;
Frank Kuechenmeister, Dresden, DE;
Daniel Gehre, Dresden, DE;
Ehrenfried Zschech, Moritzburg, DE;
Advanced Micro Devices, Inc., Austin, TX (US);
Abstract
A semiconductor device comprises a material layer adapted to efficiently stop alpha particles that are substantially generated within a solder bump of a flip chip device. The materials used for stopping the alpha particles are compatible with standard back-end processing and do not degrade adhesion of the solder bump to the remaining substrate. Moreover, a low electrical resistance is maintained and heat dissipation may be improved.