The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2005

Filed:

Sep. 05, 2003
Applicants:

Fujio Tajima, Hiratsuka, JP;

Hideaki Amano, Odawara, JP;

Teruaki Tokutomi, Odawara, JP;

Takahisa Ishida, Hadano, JP;

Kazuyuki Sonobe, Ninomiya-machi, JP;

Yasunori Fukuyama, Odawara, JP;

Tsutomu Nagakura, Hadano, JP;

Noritake Shizawa, Ninomiya-machi, JP;

Takeshi Sato, Ninomiya-machi, JP;

Inventors:

Fujio Tajima, Hiratsuka, JP;

Hideaki Amano, Odawara, JP;

Teruaki Tokutomi, Odawara, JP;

Takahisa Ishida, Hadano, JP;

Kazuyuki Sonobe, Ninomiya-machi, JP;

Yasunori Fukuyama, Odawara, JP;

Tsutomu Nagakura, Hadano, JP;

Noritake Shizawa, Ninomiya-machi, JP;

Takeshi Sato, Ninomiya-machi, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B001/00 ;
U.S. Cl.
CPC ...
Abstract

An abrasive tape is supplied to a tape head by a tape supply unit and taken up from the tape head by a tape take-up unit. The tape head presses the abrasive tape against a surface of an object under polish, which is rotated by a rotating unit. A tape head pressuring unit utilizes a voice coil motor, for example. Since the tape head pressuring unit generates a pressuring force for pressuring the tape head using the electromagnetic force, it is able to set a minute pressuring force by controlling a drive signal, and to obtain the fine adjustment of the pressuring force easily by controlling the electric signal. Therefore, it becomes possible to press the abrasive tape against the surface of the object under polish with a desired low pressure.


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