The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2005
Filed:
Jan. 23, 2001
Applicant:
John F. Mcmahon, Phoenix, AZ (US);
Inventor:
John F. McMahon, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/48 ;
U.S. Cl.
CPC ...
Abstract
A multi-chip package and a method of manufacturing the same. The multi-chip package of the present invention has a plurality of shelves. A first semiconductor is electrically coupled to at least one of the package's shelves. A second semiconductor die is electrically coupled to at least one of the package's shelves, wherein the second semiconductor die is above said first semiconductor die.