The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2005

Filed:

Oct. 23, 2002
Applicants:

Hideaki Masuko, Yokkaichi, JP;

Tadahiko Udagawa, Yokkaichi, JP;

Hiroaki Nemoto, Yokkaichi, JP;

Nobuo Bessho, Yokohama, JP;

Inventors:

Hideaki Masuko, Yokkaichi, JP;

Tadahiko Udagawa, Yokkaichi, JP;

Hiroaki Nemoto, Yokkaichi, JP;

Nobuo Bessho, Yokohama, JP;

Assignee:

JSR Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B015/08 ;
U.S. Cl.
CPC ...
Abstract

A process for forming an inorganic material layer pattern on a substrate. The process includes the steps of transferring an inorganic powder dispersed paste layer supported on a support film to the surface of the substrate to form the inorganic powder dispersed paste layer on the substrate; forming a resist film on the inorganic powder dispersed paste layer transferred to the surface of the substrate; exposing the resist film to light through a mask to form a latent image of a resist pattern; developing the exposed resist film to form the resist pattern; etching exposed portions of the inorganic powder dispersed paste layer to form an inorganic powder dispersed paste layer pattern corresponding to the resist pattern; and baking the pattern to form an inorganic material layer pattern.


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