The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2005
Filed:
Oct. 08, 2003
Hidemitsu Aoki, Kanagawa, JP;
Yoshiko Kasama, Kanagawa, JP;
Tatsuya Suzuki, Kanagawa, JP;
NEC Electronics Corporation, , JP;
Abstract
The stripping agent is sprayed from the tip of the nozzleonto the wafer surface, while the first supply nozzleis actuated to scan from the central portion of the wafer to the outer portion thereof. This operation provides the situation, in which the interface of the residual dropletis pulled back from the center of the wafer to the outer portion of the wafer by the surface tension of the stripping agent supplied from the nozzle. Meanwhile, the second supply nozzlealso scans at a same scanning speed as the first supply nozzlescans. Vapor IPA is sprayed from the orifice of the second supply nozzle. This provides that vapor IPA is sprayed onto the wafer surface immediately after the stripping agent is sprayed thereon from the first supply nozzle, and the residual stripping agent on the wafer surface is efficiently replaced with IPA.