The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2005
Filed:
Sep. 18, 2003
Oscar K. Hsu, Chelmsford, MA (US);
Jean K. Vangsness, Stow, MA (US);
Scott C. Billings, Kingston, NH (US);
David S. Gilbride, Lowell, MA (US);
Oscar K. Hsu, Chelmsford, MA (US);
Jean K. Vangsness, Stow, MA (US);
Scott C. Billings, Kingston, NH (US);
David S. Gilbride, Lowell, MA (US);
Freudenberg Nonwovens Limited Partnership, Durham, NC (US);
Abstract
A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component within a polymer matrix component. The soluble component includes particles soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the soluble particles or topographically coated on the soluble particles.