The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2005
Filed:
Sep. 12, 2002
Applicants:
Daivid Suitwai MA, Cary, NC (US);
James J. Dietz, Durham, NC (US);
George W. Alexander, Durham, NC (US);
Inventors:
Daivid Suitwai Ma, Cary, NC (US);
James J. Dietz, Durham, NC (US);
George W. Alexander, Durham, NC (US);
Assignee:
Infineon Technologies North America Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R031/02 ; G01R031/26 ;
U.S. Cl.
CPC ...
Abstract
A semiconductor wafer testing system tests one or more die clusters on a semiconductor wafer, using a test circuit to test multiple sections or areas of each die in parallel. The semiconductor wafer testing system has a buffer connected to the die cluster via the test circuit. The buffer writes test data onto a section of each die in the die cluster. The buffer reads test data from the section of each die in the die cluster.