The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2005

Filed:

Mar. 15, 2001
Applicants:

Katsumi Mori, Sakata, JP;

Kei Kawahara, Isahaya, JP;

Yoshikazu Kasuya, Sakata, JP;

Inventors:

Katsumi Mori, Sakata, JP;

Kei Kawahara, Isahaya, JP;

Yoshikazu Kasuya, Sakata, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ; H01L023/52 ;
U.S. Cl.
CPC ...
Abstract

A semiconductor device has first wiring layersand a plurality of dummy wiring layersthat are provided on the same level as the first wiring layersThe semiconductor device defines a row direction, and first virtual linear lines Lextending in a direction traversing the row direction. The row direction and the first virtual linear lines Ldefine an angle of 2-40 degrees, and the dummy wiring layersare disposed in a manner to be located on the first virtual linear lines LThe semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines Lextending in a direction traversing the column direction. The column direction and the second virtual linear lines Ldefine an angle of 2-40 degrees, and the dummy wiring layersare disposed in a manner to be located on the second virtual linear lines L


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