The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2005

Filed:

Dec. 19, 2002
Applicant:

Won-young Jung, Fremont, CA (US);

Inventor:

Won-Young Jung, Fremont, CA (US);

Assignee:

Cadence Design Systems, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/302 ; H01L021/461 ;
U.S. Cl.
CPC ...
Abstract

The present invention presents optimization methods for interconnect geometries that readily extend to the UDSM region for determining on-chip interconnect process parameters more realistically and accurately than in the prior art. A method for reconstruction flow that re-assembles each of a number of optimized structures into one optimized interconnect process file, such as a process technology file for extractors. This optimized process technology file can use not only extracted interconnect process parameters but also the input of LPE (Layout Parasitic Extraction) tools in physical verification stage.


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Jung, Won-Young. (2005). Optimization methods for on-chip interconnect geometries suitable for ultra deep sub-micron processes (U.S. Patent No. 6887791). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6887791

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