The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2005
Filed:
Aug. 07, 2002
Applicants:
Wei-feng Lin, Hsinchu, TW;
Wei-chi Liu, Pingtung, TW;
Chung-ju Wu, Kaohsiung, TW;
Inventors:
Assignee:
Silicon Integrated Systems Corp., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ;
U.S. Cl.
CPC ...
Abstract
A die paddle for receiving an integrated circuit die in a plastic substrate. The die paddle is defined by a copper film on the plastic substrate and comprises a plurality of via holes through the plastic substrate, a plurality of opening through the copper film, and a gold-containing ring formed on the peripheral portion of the copper film. The outermost openings (and/or the outermost via holes) and the gold-containing ring are separated by a distance of about 1 to about 20 mils.