The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2005

Filed:

Nov. 09, 2000
Applicants:

Thomas Gebele, Freigericht, DE;

Jurgen Henrich, Limeshain, DE;

Stefan Bangert, Steinau, DE;

Jürgen Honekamp, Hanau, DE;

Elisabeth Budke, Hürth, DE;

Jürgen Ulrich, Schöneck, DE;

Helmut Grimm, Darmstadt, DE;

Inventors:

Thomas Gebele, Freigericht, DE;

Jurgen Henrich, Limeshain, DE;

Stefan Bangert, Steinau, DE;

Jürgen Honekamp, Hanau, DE;

Elisabeth Budke, Hürth, DE;

Jürgen Ulrich, Schöneck, DE;

Helmut Grimm, Darmstadt, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C016/00 ; H05H001/02 ;
U.S. Cl.
CPC ...
Abstract

An electrode arrangement for the plasma-aided coating of a substrate () with a layer of material comprising at least one first and a second material component and for the production of a plasma discharge, more especially an arc discharge (), having an anode arrangement (), which provides the first material component at an anode material surface () for evaporation, and a cathode arrangement (), which provides the second material component at a cathode material surface (). The electrode arrangement is characterized in that the cathode material surface () is constituted by an evaporation-active part () supporting the plasma discharge () and an evaporation-inactive part () not supporting the plasma discharge. Preferably, a motion-producing means () is provided for moving the evaporation-inactive part () over the cathode material surface () in order to reduce deposit of material due to he first material component on the cathode material surface ().


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