The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2005
Filed:
Dec. 16, 2002
Applicants:
Kazushi Sano, Okayama, JP;
Yoshihiro Okada, Okayama, JP;
Hiromasa Miyoshi, Okayama, JP;
Inventors:
Assignee:
Dowa Mining Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F001/00 ;
U.S. Cl.
CPC ...
Abstract
When copper powder manufactured by a wet reduction method is kneaded with resin in a high filling rate, it is difficult to maintain a low viscosity. The invention is to solve the problem of high viscosity without changing the characteristics such as particle size and specific surface area of the copper powder obtained by a wet reduction method. This invention relates to copper powder for an electrically conductive paste wherein copper powder manufactured by a wet reduction method is subjected to a surface-flattening treatment in which the particles are mechanically collided each other.