The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2005
Filed:
Aug. 27, 2003
Takashi Wada, Kodaira, JP;
Takuji Ide, Higashimurayama, JP;
Eiji Niihara, Hinode, JP;
Shunichiro Fujioka, Hinode, JP;
Mitsue Ueno, Hamura, JP;
Takashi Wada, Kodaira, JP;
Takuji Ide, Higashimurayama, JP;
Eiji Niihara, Hinode, JP;
Shunichiro Fujioka, Hinode, JP;
Mitsue Ueno, Hamura, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor device according to the invention is provided with square first semiconductor chip and second semiconductor chip laminated with each one main surface opposite, a supporting lead a part of which is arranged between one main surface of the first semiconductor chip and one main surface of the second semiconductor chip and a resin sealing body that seals the first semiconductor chip, the second semiconductor chip and the supporting lead and is characterized in that the respective one main surfaces of the first semiconductor chip and the second semiconductor chip are bonded to a part of the supporting lead via an adhesive layer and a part of the supporting lead is formed so that it has smaller width than the respective sides of the first semiconductor chip and the second semiconductor chip.