The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2005
Filed:
Dec. 16, 2002
Jackson Hsieh, Hsinchu Hsien, TW;
Jichen Wu, Hsinchu Hsien, TW;
Bruce Chen, Hsinchu Hsien, TW;
Worrell Tsai, Hsinchu Hsien, TW;
Jackson Hsieh, Hsinchu Hsien, TW;
Jichen Wu, Hsinchu Hsien, TW;
Bruce Chen, Hsinchu Hsien, TW;
Worrell Tsai, Hsinchu Hsien, TW;
Kingpak Technology, Inc., Hsinchu Hsien, TW;
Abstract
An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a-shaped structure. The molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first boards are partially encapsulated by the first molded body. The second and third boards are exposed from bottom and side surfaces of the first molded body. The chip is mounted within the cavity. The pads are formed on the chip. The wires electrically connect the pads to input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the chip.