The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2005

Filed:

Jan. 15, 2003
Applicants:

Takeshi Kondo, Urawa, JP;

Kazuhiro Takahashi, Kawaguchi, JP;

Yoshihisa Mineura, Tokyo, JP;

Inventors:

Takeshi Kondo, Urawa, JP;

Kazuhiro Takahashi, Kawaguchi, JP;

Yoshihisa Mineura, Tokyo, JP;

Assignee:

Lintec Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B007/12 ;
U.S. Cl.
CPC ...
Abstract

A pressure sensitive adhesive sheet comprising a substrate, an intermediate layer superimposed thereon and a pressure sensitive adhesive layer superimposed on the intermediate layer, characterized in that the pressure sensitive adhesive layer exhibiting an elastic modulus at 23° C. ranging from 5.0×10to 1.0×10Pa, the intermediate layer exhibiting an elastic modulus at 23° C. which is not greater than the elastic modulus at 23° C. of the pressure sensitive adhesive layer, or the intermediate layer exhibiting an elastic modulus at 40° C. of less than 1.0×10Pa. At the time of working of the back of an adherend having a surface whose unevenness height differences are large, this pressure sensitive adhesive sheet is preferably stuck to the adherend surface to thereby protect it during the working and to enable performing the grinding at a uniform thickness without the occurrence of dimples.


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