Method of fabrication for a socket with embedded conductive structure

Abstract

A method for fabricating a socket (FIG.) includes fabricating a conductive structure (FIG.) and embedding the conductive structure in a housing (). The housing includes multiple openings () formed in the top surface. Each opening () provides access to conductive contacts (FIG.), which provide an electrical interface between a device that is inserted into the socket and the next level of interconnect (e.g., a PC board). In one embodiment, the embedded conductive structure () is electrically connected to one or more ground conducting contacts (FIG.B). The conductive structure includes column walls (), which run in parallel with columns of contacts, and row walls (), which run in parallel with rows of contacts and which intersect the column walls. In this manner, the conductive structure forms multiple chambers (FIG.).