The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6875629 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 05, 2005

Filed:

Jun. 03, 2002
Applicants:

Masanobu Senda, Aichi, JP;

Naoki Shibata, Aichi, JP;

Jun Ito, Aichi, JP;

Toshiaki Chiyo, Aichi, JP;

Inventors:

Masanobu Senda, Aichi, JP;

Naoki Shibata, Aichi, JP;

Jun Ito, Aichi, JP;

Toshiaki Chiyo, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/00 ;
U.S. Cl.
CPC ...
Abstract

A separator layer of Ti is formed on an auxiliary substrate of sapphire or the like. An undercoat layer of TiN is formed on the separator layer. The undercoat layer is provided so that a Group III nitride compound semiconductor layer can be grown with good crystallinity on the undercoat layer. TiN is sprayed on the undercoat layer to form a thermal spray depositing layer. Then, the separator layer is chemically etched to reveal the undercoat layer. Then, a Group III nitride compound semiconductor layer is grown on a surface of the undercoat layer.


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Senda, Masanobu. (2005). Iii group nitride based semiconductor element and method for manufacture thereof (U.S. Patent No. 6875629). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6875629

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