The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2005
Filed:
Mar. 19, 2003
Makoto Suwa, Hyogo, JP;
Junko Matsumoto, Hyogo, JP;
Tadaaki Yamauchi, Hyogo, JP;
Takeo Okamoto, Hyogo, JP;
Tetsuichiro Ichiguchi, Hyogo, JP;
Hideki Yonetani, Hyogo, JP;
Tsutomu Nagasawa, Hyogo, JP;
Zengcheng Tian, Hyogo, JP;
Makoto Suwa, Hyogo, JP;
Junko Matsumoto, Hyogo, JP;
Tadaaki Yamauchi, Hyogo, JP;
Takeo Okamoto, Hyogo, JP;
Tetsuichiro Ichiguchi, Hyogo, JP;
Hideki Yonetani, Hyogo, JP;
Tsutomu Nagasawa, Hyogo, JP;
Zengcheng Tian, Hyogo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
Data pad regions are arranged in four divided regions of a semiconductor memory chip of a rectangular shape, respectively, and data pads are selectively utilized in each of the four divided regions in accordance with a word structure. Thus, it is possible to implement a semiconductor memory chip capable of being assembled in both a single chip package and a multi chip package.