The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2005
Filed:
Jun. 04, 2003
Naoyuki Koizumi, Nagano, JP;
Naohiro Mashino, Nagano, JP;
Takashi Kurihara, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A method of manufacturing a micro-semiconductor element comprising the following steps of: adhering a semiconductor waferhaving a circuit surface and a back surface to a support platevia a protective filmso that the circuit surface faces to the protective film; reducing a thickness of the semiconductor wafer while the semiconductor wafer is supported by the support plate; dividing the semiconductor wafer into individual semiconductor elementswhile the semiconductor wafer is adhered to the protective film; moving the semiconductor elements from the protective film to an adhesive peeling filmin such a manner that the back surfaces of the semiconductor elements are adhered to the peeling film; supporting a periphery of the peeling film by a support ring; and picking up the individual semiconductor element by a pickup device when the back surface of semiconductor element is pushed up, via the peeling film, by a pushup pin. An individual semiconductor element can also be picked up by an air suction nozzle