The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2005
Filed:
Mar. 07, 2003
Applicants:
Tasao Soga, Hitachi, JP;
Hanae Hata, Yokohama, JP;
Tetsuya Nakatsuka, Yokohama, JP;
Mikio Negishi, Komoro, JP;
Hirokazu Nakajima, Saku, JP;
Tsuneo Endoh, Komoro, JP;
Inventors:
Tasao Soga, Hitachi, JP;
Hanae Hata, Yokohama, JP;
Tetsuya Nakatsuka, Yokohama, JP;
Mikio Negishi, Komoro, JP;
Hirokazu Nakajima, Saku, JP;
Tsuneo Endoh, Komoro, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B015/02 ; H01L021/60 ;
U.S. Cl.
CPC ...
Abstract
In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.