The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2005
Filed:
Sep. 24, 2002
Applicant:
Masatoshi Nanjo, Tokyo, JP;
Inventor:
Masatoshi Nanjo, Tokyo, JP;
Assignee:
Disco Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ; H01L021/48 ; H01L021/50 ; H01L021/301 ; H01L021/46 ;
U.S. Cl.
CPC ...
Abstract
Prior to a grinding step, the front surface of a semiconductor wafer is stuck on a substrate to be mounted on the substrate. The transfer step of mounting the semiconductor wafer on a frame having a mounting opening in its center portion through a mounting tape and removing the substrate from the front surface of the semiconductor wafer is carried out between the grinding step and the subsequent treating step. The substrate is formed of a laminate consisting of a plurality of layers.