The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Sep. 19, 2002
Applicant:
Michael Hübner, Schönau, DE;
Inventor:
Michael Hübner, Schönau, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L023/544 ;
U.S. Cl.
CPC ...
Abstract
A method for rewiring contact pads in the wafer-level package is inventively provided. In order to be able to make the terminals of the characterization pads available for testing in a wafer-level package without these terminals being available later to the end user, the invention provides that the rewiring line is led via the scribe line of the wafer.
Hübner, Michael. (2005). Method for rewiring pads in a wafer-level package (U.S. Patent No. 6867479). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6867479
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile