The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6867056 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 15, 2005

Filed:

Oct. 30, 2002
Applicants:

Christine Hau-riege, Fremont, CA (US);

Amit P. Marathe, Fremont, CA (US);

Inventors:

Christine Hau-Riege, Fremont, CA (US);

Amit P. Marathe, Fremont, CA (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/66 ;
U.S. Cl.
CPC ...
Abstract

For testing for stress-migration failure of interconnect, an interconnect test structure is formed with a first feeder line coupled to a test line by a first no-flux structure, and with a second feeder line coupled to the test line by a second no-flux structure. A respective width of ea ch of the first and second feeder lines is greater than a width of the test line. A resistance meter and a timer measure a stress-migration life-time of the interconnect test structure with a current being continuously conducted through the interconnect test structure that is continuously heated to a predetermined temperature.


Find Patent Forward Citations

Hau-Riege, Christine. (2005). System and method for current-enhanced stress-migration testing of interconnect (U.S. Patent No. 6867056). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6867056

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…