The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2005
Filed:
Feb. 28, 2003
Han-kun Hsieh, Miaoli, TW;
Wei-feng Lin, Hsinchu, TW;
Han-Kun Hsieh, Miaoli, TW;
Wei-Feng Lin, Hsinchu, TW;
Silicon Integrated Systems Corp., Hsin Chu, TW;
Abstract
A padless high density circuit board and manufacturing method thereof. The method includes providing a circuit board substrate, forming external wiring, having a plurality of external terminals with a width as large as or less than the external wiring on the circuit board substrate, forming a solder mask over the circuit board substrate and the external wiring with a plurality of solder mask openings exposing the external terminals, with diameters at least as large as the widths of the external terminals exposed thereby, and forming a plurality of conductive bumps on the external terminals exposed by the solder mask openings for connection with an external device in a subsequent assembly process.