The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2005

Filed:

Jul. 30, 2002
Applicants:

Marc Epitaux, Sunnyvale, CA (US);

Peter E. Kirkpatrick, Berkeley, CA (US);

Jean-marc Verdiell, Palo Alto, CA (US);

Inventors:

Marc Epitaux, Sunnyvale, CA (US);

Peter E. Kirkpatrick, Berkeley, CA (US);

Jean-Marc Verdiell, Palo Alto, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L031/0203 ;
U.S. Cl.
CPC ...
Abstract

A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.


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