The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2005

Filed:

Nov. 04, 2003
Applicants:

Takashi Terauchi, Tokyo, JP;

Shigeru Shiratake, Tokyo, JP;

Inventors:

Takashi Terauchi, Tokyo, JP;

Shigeru Shiratake, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L029/76 ;
U.S. Cl.
CPC ...
Abstract

A semiconductor device having a memory cell portion and a peripheral circuit portion is provided which achieves suppression of reduction of punch-through margin of transistors in the peripheral circuit portion and offers ensured short margin and enhanced current driving capability. After a high-temperature (800° C. to 1000° C.) thermal treatment that is performed to improve burying characteristics after formation of an interlayer insulating film, and also after a high-temperature (800° C. to 1000° C.) thermal treatment that is performed to enhance refresh characteristics after formation of contact plugs in the memory cell portion, a silicon oxide film and insulating film formed on a semiconductor substrate in the peripheral circuit portion are removed by anisotropic dry-etching, leaving the insulating film as sidewall insulating films on sides of sidewall nitride films. Then an impurity ion implantation process is performed using gate interconnections as implant masks to form source/drain regions in the peripheral circuit portion.


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